Goldlink Tongda Electroncis Co., Ltd

Rm619,Huafengxin'an building, Baoan
Shenzhen, 518101
China

Tel: 86-755-27579310
Fax: http://www.glpoly.com
Website: https://http://www.glpoly.com

Contact: Lyn Gui, Sales

Email:

Type of Business:

Manufacturer, Exporter/Importer

Employees:

50

Year Established:

2008

Certification:

ISO 14000/14001, ISO/TS 16949, OHSAS 18001, IATF16949

Annual Sales Volume:

greater than $500M

Export Percentage:

41-60%

Annual Purchasing Volume:

$200M to $500M

Contract Manufacturing:

OEM Services, ODM Services, Buyer Labels Offered

Ownership Type:

Sole Proprietorship

Registered Capital:

$1M to $2.5M

Bank Ref:

Bank of China Hongkong Branch

Harmonized System Codes:

3910

Business Message

GLPOLY is committed to becoming a leading enterprise in the field of thermal interface material. At Goldlink, developing high quality Thermal Interface Material and Thermal Solutions for electronics industry is our first priority.

We serve a multitude of industries worldwide including automotive, computer, 5G telecommunications, consumer electronics, LED lighting, solar, military and power conversion. We pride ourselves on rapid sampling, extensive product portfolio and top-class technical support. As a professional Thermal Interface Material manufacturer, we understand problems, we also know that there will always be a better way to help you achieve your goals and objectives.

GLPOLY is focused on a single purpose---discovering the need, then developing and delivering the advanced thermal solutions through devotion and innovation.

Provides Complete Portfolio of Thermal Interface Materials For You	Selecting Non-silicone Thermal Gel, Keep Your Electronics Running Cooler	8.0W/mK Thermal Gap Fiiler Pad-An Alternative To Laird Tflex900	Non-silicone Thermal Gel-Ideal For Silicone-sensiti ve, Low Stress Devices	7.0W/mK Thermal Putty Keeps Your 5G Devices Cool and Well Performed
GLPOLY Highly Compressive Thermal Pad For Multiple Gap Thickness	GLPOLY Performance Thermal Gel-Design For Auto Pilot Thermal Management	4.0W/mK Thermal Gel Designed For Low Stress Electronic Applications	6.0W/mK Thermal Gap Pad Substitutes For Fujipoly GR45A	GLPOLY Non-silicone Thermal Pad Eliminates Silicone Oil Concerns
8W/mK Thermal Pad-Designed To Optimize Thermal Management of 5G Devices	Non-silicone Thermal Gel--Maybe GLPOLY Is The Only One That Can Provide	GLPOLY Thermal Gap Filler Pad Help Improve Thermal Management of 5G Devices	Thermal Gap Pad For Electronics Cooling, Alternative To Laird Tflex700	Thermal Putty Keeps Automotive Electronics Running Cooler
GLPOLY Thermal Gap Filler Designed For EV Battery Pack Cooling	GLPOLY Thermally Conductive Epoxy Adhesive For EV Battery Pack Cooling	Top-rank Thermally Conductive Insulator Film Supplier in China--GLPOLY	GLPOLY Thermal Gap Filler vs CGW-2 For EV Battery Cooling	GLPOLY Provides Complete Portfolio of Thermal Interface Materials
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