Goldlink Tongda Electroncis Co., Ltd

Rm619,Huafengxin'an building, Baoan
Shenzhen, 518101
China

Tel: 86-755-27579310
Fax: http://www.glpoly.com
Website: https://http://www.glpoly.com

Contact: Lyn Gui, Sales

Email:

Type of Business:

Manufacturer, Exporter/Importer

Employees:

50

Year Established:

2008

Certification:

ISO 14000/14001, ISO/TS 16949, OHSAS 18001, IATF16949

Annual Sales Volume:

greater than $500M

Export Percentage:

41-60%

Annual Purchasing Volume:

$200M to $500M

Contract Manufacturing:

OEM Services, ODM Services, Buyer Labels Offered

Ownership Type:

Sole Proprietorship

Registered Capital:

$1M to $2.5M

Bank Ref:

Bank of China Hongkong Branch

Harmonized System Codes:

3910

Business Message

GLPOLY is committed to becoming a leading enterprise in the field of thermal interface material. At Goldlink, developing high quality Thermal Interface Material and Thermal Solutions for electronics industry is our first priority.

We serve a multitude of industries worldwide including automotive, computer, 5G telecommunications, consumer electronics, LED lighting, solar, military and power conversion. We pride ourselves on rapid sampling, extensive product portfolio and top-class technical support. As a professional Thermal Interface Material manufacturer, we understand problems, we also know that there will always be a better way to help you achieve your goals and objectives.

GLPOLY is focused on a single purpose---discovering the need, then developing and delivering the advanced thermal solutions through devotion and innovation.

3.0W/mK Thermal Gap Filler For Motor and Battery Pack Cooling	GLPOLY Electrical Insulation PCM Is An Alternative To Bergquist Hi-Flow300P	GLPOLY Battery Cell Thermally Conductive Epoxy Adhesive	High Thermal Conductivity Thermal Gap Pad Applied To Military Equipment	High Performance Thermal Gap Pad-Real Data, No Trick
Low Thermal Reistance Thermal Gap Pad Improves Heat Transfer	GLPOLY Thermal Gap Pad-Low Oil Bleed, Low Thermal Resistance	Non-dry Out Non-silicone Thermal Gel Helps Electronics Run Cooler	GLPOLY 6W/mK Thermal Gap Pad Improve 5G Telecom Equipment Heat Transfer	5W/mK Thermal Gap Pad Improves Electronics Heat Transfer
Non-silicone Thermal Gel For Silicone-sensiti ve Devices	Strong Bond Thermally Conductive Adhesive For EV Battery Pack or Cell	Non-silicone Thermal Gel Performs Under Extreme Temperature	GLPOLY Thermally conductive adhesive vs Bergquist Liqui-Bond EA1805	GLPOLY Thermal Pad Provides Similar Performance To Laird Tflex800
A Real Thermally Conductive Structural Epoxy Adhesive For Your Battery Pack	GLPOLY Thermally Conductive Insulator Takes Bergquist Sil-Pad as Benchmark	GLPOLY Thermal Gap Pad Has Been Applied To EV Charger	GLPOLY Hybrid Thermal and EMI Absorber Alternative To Laird Coolzorb500	High Performance Thermal Gel For Robot Thermal Management
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